UEFC-4900 - VACTEC GmbH

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UEFC-4900

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Temescal UEFC-4900 Deposition System

Maximum Throughtput in Lift-Off Processes
The Temescal UEFC-4900 with Auratus is the compace version of the UEFC-5700. 
It represents the ultimate mid-sized coater for lift-off processes. The source-to-
substrate distance and chamber angles in the UEFC-4900 have been optimized for 
150mm wafers and the system supports 25 x 150mm wafers.
The load locked product chamber is pumped by a CTI model CT-500 cryogenic pump. 
Powerful cryopumps make it possible to pump this large chamber in 15 minutes from 
atmosphere to pressures in the range of 10E-7. During wafer exchanges, the source 
chamber is maintained at high vacuum by the independent pumping of a dedicated 
10-inch cryopump.

 
 
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