FC-3800 - VACTEC GmbH

Temescal FC-3800 Deposition System

The  FC-3800 represents Temescal`s ultimate high throughput platform for lift-

off and/or step coverage applications.
In each load, this load lock system can coat twenty-five 150mm diameter wafers
for lift off or thirty-six 150mm wafers for step coverage. The 38" x 38" x 28" product
chamber is pumped by a high throughput 16" cryopump. During wafer exchanges, the 

source chamber is maintained at high vacuum by the independent pumping of a
dedicated 10" cryopump.
 
Key Features:
-Product chamber dimensions: 28" high x 38" x 38"
-25.5" diameter source tray
-Standard source-to-substrate distance: 34"
-S-S distance with optional source well extension collar: 

-38" Product and source chamber cryopumps

System Control
-Temescal Control System (TCS), providing Auto, Manual, and Service Modes plus 

 process datalogging

-TCS-based process variable monitoring (PVM) allows user to set process tolerance 

 alarms
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