Coating Systems - VACTEC GmbH

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Coating Systems

Produkte

                                                Temescal, the expert in metallization for the processing of Compound Semiconductor
                                                based substrates, provides the best evaporation system available.
                                                Temescal systems provide controlled multi-layer coatings of materials such as Ti, Pt, Ag, Al,
                                                Cr, Cu, Mo, Sn, SiO2 and ITO. Repeatable uniformity and performance guaranteed.

Temescal UEFC-5700 Deposition System
Maximum Throughput in Lift-Off Process.

Wafer Sizes: 50mm to 200mm

Source-to-Substrate distance: 43"

Temescal UEFC-4900 Deposition System
Maximum Throughput in Lift-Off Process.

Wafer Size: 25 x 150mm

Wafer Size: 45 x 100mm

Source-to-Substrate distance:

Optimized for 150mm wafers

Temescal FC-4400 Deposition System
Load locked for Maximum Throughputin

Lift-Off Processes.
Wafer Sizes: 100mm to 200mm
Source-to-Substrate distance: 38" or 42"

Temescal FC-3800 Deposition System
For Production Lift-Off, Step Coverage and

Dual-Sided Coating Aplications.
Wafer Sizes: 100mm to 200mm
Source-to-Substrate distance: 34" or 38"

Temescal FC/BCD 2800 Deposition System
Mid-Sized Coaters for Production and Large Wafer
R&D Applications.
Wafer Sizes: 3" to 200mm
Source-to-Substrate distance: 34" or 42"

Temescal FC/BJD-2000 Bell Jar Deposition System
Convertible Bell Jar Systems for Small-Scale Production

and R&D Applications.
Wafer Sizes: 2" to 150mm
Source-to Substrate distance: 19,5" to 27,5